What is wafer probing process?
Wafer probing is the process of electrically testing each die on a wafer. 1), which holds a wafer on a stable platform and drops a set of precision point needles on designated probe pads on the die. The probe system is usually connected to an automatic test equipment (ATE) using special interfacing hardware (see Fig.
What is probe in semiconductor?
A probe card is an interface between an electronic test system and a semiconductor wafer. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, thereby permitting the testing and validation of the circuits at the wafer level, usually before they are diced and packaged.
What is wafer probe station?
Probe stations allow a user to position electrical, optical or RF probes on a silicon wafer so that the device can be tested. Tests can be run either before or after the wafer has been sawn into individual dies.
What is wafer prober machine?
A wafer prober is a machine (Automatic test equipment) used to test integrated circuits. For electrical testing a set of microscopic contacts or probes called a probe card are held in place whilst the wafer, vacuum-mounted on a wafer chuck, is moved into electrical contact.
What is important role of wafer probe?
In semiconductor development, a wafer prober is used mainly for evaluating the characteristics of prototype ICs, reliability evaluation, and defect analysis. Additionally, a temperature control function is required for checking operation at low and high temperatures and for reliability evaluation.
What is wafer final test?
The machine marks each bad chip with a drop of dye. Chips are also tested again after packaging, as the bond wires may be missing, or analog performance may be altered by the package. This is referred to as “final test”. Page 6. Wafer Test (1D)
What is the important role of wafer probe?
What is the four probe method?
The most common technique used for measuring sheet resistance is the four-probe method. This technique involves using four equally-spaced, co-linear probes (known as a four-point probe) to make electrical contact with the material. Most four-point probes available commercially use sharp needles as probes.
What is the purpose of a probe station?
Probe stations allow a user to position electrical, optical or RF probes onto a device and to then test the response of that device to an external stimulus (electrical, optical or RF).
What is a probe station used for?
A Mechanical probe station is used to physically acquire signals from the internal nodes of a semiconductor device. The probe station utilizes manipulators which allow the precise positioning of thin needles on the surface of a semiconductor device.
Why do wafers bump?
Wafer bumping is an advanced manufacturing process whereby metal solder balls or bumps are formed on the semiconductor wafer prior to dicing. Wafer bumps provide an interconnection between the die and a substrate or printed circuit board in a device.
What wafer means?
(Entry 1 of 2) 1a : a thin crisp cake, candy, or cracker. b : a round thin piece of unleavened bread used in the celebration of the Eucharist. 2 : an adhesive disk of dried paste with added coloring matter used as a seal.
When do you use a wafer probing test?
Wafer Probing. Semiconductor manufacturers use wafer probing as a first characterization of the parts on the wafer. It is not meant to be the final test of the device which comes after it is packaged. The manufacturer chooses probe tests and limits to find and remove die that are not worth packaging.
How does a wafer probe and trim work?
Probe/Trim Wafer probing is the process of electrically testing each die on a wafer. This is done automatically using a wafer probing system (see Fig. 1), which holds a wafer on a stable platform and drops a set of precision point needles on designated probe pads on the die.
How many probes are in a wafer probe station?
Multiple optical instruments like IR radiation sources (black bodies), and up to eight probe positioners and/or a probe card can be integrated. The high stability design provides excellent contact quality and accurate measurement results in a condensation-free test environment.
How is a wafer prober used to test dice?
Wafer prober. For electrical testing a set of microscopic contacts or probes called a probe card are held in place whilst the wafer, vacuum-mounted on a wafer chuck, is moved into electrical contact. When a die (or array of dice) have been electrically tested the prober moves the wafer to the next die (or array) and the next test can start.